By Rick Harwig (auth.), Satyen Mukherjee, Ronald M. Aarts, Raf Roovers, Frans Widdershoven, Martin Ouwerkerk (eds.)
Ambient Intelligence is among the new paradigms within the improvement of knowledge and verbal exchange know-how, which has attracted a lot consciousness during the last years. the purpose is the to combine know-how into humans atmosphere in this type of manner that it improves their day-by-day lives by way of healthiness, creativity, and productiveness. Ambient Intelligence is a multidisciplinary suggestion, which seriously builds on a couple of primary breakthroughs which were accomplished within the improvement of latest techniques over the last years. New insights in nano and micro electronics, packaging and interconnection know-how, large-area electronics, power scavenging units, instant sensors, low energy electronics and computing systems let the conclusion of the heaven of ambient intelligence through overcoming the hell of physics. in keeping with contributions from prime technical specialists, this publication offers a couple of key subject matters on novel advancements, therefore delivering the reader an exceptional perception into the actual foundation of ambient intelligence. It additionally shows key learn demanding situations that needs to be addressed sooner or later.
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With emissive polymers, new types of displays can be made in principle, such as dual sided displays, or a transparent display integrated onto a window’s pane. Eventually, one would like to develop a reflective display technology that would offer high contrast images even under conditions of bright sunlight. Both LCD and polymer LED displays suffer from poor daylight contrast. A contender in the race towards developing real ‘‘electronic paper’’ is the electrophoretic display technology that is being developed jointly by e-ink and Philips.
1. CIRCUITS AND TECHNOLOGIES 39 and not by a deposition layer thickness, it is possible to fabricate devices with many unique resonant frequencies on the same wafer. A proof-of-concept, 2 GHz bulk acoustic wave (BAW) resonator was codesigned with a 0:18 mm CMOS oscillator . 1–6. The BAW resonator die is wirebonded directly to the CMOS chip. The elimination of surface mount quartz crystals, the low power consumption, and the fast start-up time makes this a good candidate to replace the quartz-based PLL in low power, highly integrated, agile transceivers.
Added value in a SiP is achieved by integration of several functions into a single module or package thereby combining electrical as well as nonelectrical elements. The challenge for SiP will be to develop a degree of standardization and reuse, so that an economically viable industry can be built. Of course, the economics will be quite different for high volume consumer applications and low volume professional applications, for example health care. 2. Open Innovation Approaches In the world of ‘‘more of Moore’’, the exploding costs of realizing successive technology generations have become almost prohibitive.
AmIware Hardware Technology Drivers of Ambient Intelligence by Rick Harwig (auth.), Satyen Mukherjee, Ronald M. Aarts, Raf Roovers, Frans Widdershoven, Martin Ouwerkerk (eds.)